Dynaloy Dynastrip AP7880-T光刻胶去除剂
Dynaloy Dynastrip AP7880-T光刻胶去除剂有效溶解焊料凸点工艺（包括铜柱和无铅工艺）中难以去除的厚负性光刻胶
Dynaloy Dynastrip AP7880-T光刻胶去除剂
•Dynaloy Dynastrip AP7880-T光刻胶去除剂有效溶解焊料凸点工艺（包括铜柱和无铅工艺）中难以去除的厚负性光刻胶
•Dynaloy Dynastrip AP7880-T光刻胶去除剂高负载能力因此可以减少CoO工艺
•Dynaloy Dynastrip AP7880-T光刻胶去除剂仅在亚太市场提供
Dynastrip AP7880-T
• Effective for dissolving hard to remove thick-negative photoresist in solder bumping processes including Cu pillar and lead-free processes
• High loading capacity results in low process CoO
• Available only in Asia Pacific market
