DYNASTRIP DL88 多用途光刻胶去除剂
DYNASTRIP DL88 多用途光刻胶去除剂是一种独特配方的光刻胶去除产品,专为晶圆级封装 (WLP) 应用而设计。
DYNASTRIP DL88 多用途光刻胶去除剂是一种独特配方的光刻胶去除产品,专为晶圆级封装 (WLP) 应用而设计。
DYNASTRIP DL88 多用途光刻胶去除剂是一种独特配方的光刻胶去除产品,专为晶圆级封装 (WLP) 应用而设计。
DYNASTRIP DL88用于从对腐蚀敏感的金属上剥离正性光刻胶
Dynastrip DL88 完全可用水冲洗。
DYNASTRIP DL88有效去除助焊剂残留物
DYNASTRIP DL88可以用量在线喷淋工艺
DYNASTRIP DL88 Multipurpose Photoresist Remover is a uniquely formulated photoresist removal product designed specifically for wafer level packaging (WLP) applications.
Formulated to strip positive photoresist from metals that are sensitive to corrosion
Dynastrip DL88 is completely water rinsable.
Effective for flux residue removal
Batch spray processing