DOWSIL 3-6751 Thermally Conductive Adhesive
陶熙DOWSIL 3-6751导热粘合剂灰色是一种双组分、热固化、低粘度的硅酮,用于在热传输过程中冷却电子、汽车和电源应用。陶熙DOWSIL 3-6751导热粘合剂还可以很好地粘合金属、陶瓷、填充塑料和环氧树脂层压板。
陶熙DOWSIL 3-6751导热粘合剂灰色是一种双组分、热固化、低粘度的硅酮,用于在热传输过程中冷却电子、汽车和电源应用。陶熙DOWSIL 3-6751导热粘合剂还可以很好地粘合金属、陶瓷、填充塑料和环氧树脂层压板。
DOWSIL 3-6751 Thermally Conductive Adhesive
陶熙DOWSIL 3-6751导热粘合剂灰色是一种双组分、热固化、低粘度的硅酮,用于在热传输过程中冷却电子、汽车和电源应用。陶熙DOWSIL 3-6751导热粘合剂还可以很好地粘合金属、陶瓷、填充塑料和环氧树脂层压板。它具有阻燃性、自流平性和流动性。1: 1混合比。1 kg套件。
Dow DOWSIL 3-6751 Thermally Conductive Adhesive Gray is a two component, heat curing, low viscosity silicone that is used to cool electronics, automotives, and power supply applications during thermal transfers. It also bonds well to metals, ceramics, filled plastics, and epoxy laminates. It is flame resistant, self leveling, and flowable. 1:1 mix ratio. 1 kg Kit.
Typical Use: Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates.
Brand: DOWSIL
Color: Gray
Components: 2 part
Cure Time: 50min @ 100 °C; 40min @ 125 °C; 10min @ 150 °C
Dielectric Strength: 17.9 kV/mm
Elongation: 35%
Flash Point: >200 °C
Hardness: 67 A
Mix Ratio: 1:1
Shear Strength: 555
Specific Gravity: 2.3
Tensile Strength: 400 psi
Thermal Conductivity: 1.1 W/mK
Viscosity: 10,000
Volume Resistivity: 7.2e + 13 ohm-cm
Working Time: 2h @ room temperature